Relationship of board density and resin contents towards the particleboard properties from weathered oil palm trunk / Jamaludin Kasim …[et al.]

Kasim, Jamaludin and Che Kar, Muhamad Nasrulrahman and Wan Abd Rahman, Wan Mohd Nazri and Ahmad, Nurrohana and Sarmin, Siti Noorbaini and Mohd Yunus, Nur Yuziah and Mansor, Rafizah (2013) Relationship of board density and resin contents towards the particleboard properties from weathered oil palm trunk / Jamaludin Kasim …[et al.]. In: Prosiding KONAKA Konferensi Akademik 2013, 28-29 Oktober 2013, Bukit Gambang Resort City, Gambang, Pahang, Malaysia.

Abstract

In this study, the relationship of density and resin content (RC) on mechanical and physical properties of
particleboard manufactured from weathered oil palm trunk particles were determined Weathered trunk of
Oil palm (Elaeis guineensis Jacq.) was used as alternative raw materials for particleboard manufacturing.
During board manufacture, resin content (7, 9 and 11%) and density (500, 600 and 700kg/m3) were used
The experimental panels were tested for their mechanical strength including modulus of rapture (MOR),
modulus of elasticity (MOE), internal bonding (IB) and physical properties thickness swelling (TS) and water
absorption (WA) were determine based on British European (BS EN) standard Mechanical properties and
physical properties strength of particleboard increased toward higher board density and resin contents. All
of particleboard does not satisfy the minimum MOR, MOE, IB and TS standard requirement of non-load
bearing particleboards for general use.

Metadata

Item Type: Conference or Workshop Item (Paper)
Creators:
Creators
Email / ID Num.
Kasim, Jamaludin
djamal@pahang.uitm.edu.my
Che Kar, Muhamad Nasrulrahman
UNSPECIFIED
Wan Abd Rahman, Wan Mohd Nazri
wmdnazri@pahang.uitm.edu.my
Ahmad, Nurrohana
nurrohana@pahang.uitm.edu.my
Sarmin, Siti Noorbaini
baini@pahang.uitm.edu.my
Mohd Yunus, Nur Yuziah
yuziah@yahoo.com
Mansor, Rafizah
rafizah@yahoo.com
Subjects: T Technology > TS Manufactures > Wood technology. Lumber
T Technology > TS Manufactures > Engineered wood. Fiberboard, particle board, etc.
T Technology > TS Manufactures > Wood technology. Lumber > Chemical processing of wood
Divisions: Universiti Teknologi MARA, Pahang > Jengka Campus
Event Title: Prosiding KONAKA Konferensi Akademik 2013
Event Dates: 28-29 Oktober 2013
Page Range: pp. 218-224
Keywords: Oil palm trunk, Particleboard, Density, Resin content
Date: 2013
URI: https://ir.uitm.edu.my/id/eprint/39921
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