Abstract
This paper demonstrates the fabrication of based memristive device by sputtering method. Titania thin film was deposited on a glass substrate sandwiched with platinum layer as its metal electrode. The sputtered titania layer was exposed to argon plasma to create the oxygen vacancies that are needed to enhance the memristive behavior. In this work the plasma treatment time was varied for 5, 10, and 15 minutes. In order to analyze the surface TiO₂, we use scanning electron microscopy FESEM. We have also done the Raman measurement analyse phase structure of the titania layer. The reading I-V measurement was taken to analyze the memristive behavior at different plasma treatments. The current-voltage (I-V) was taken at loop 0 V to -5 V, -5 V to 5 V and 5 V to 0 V at every sample. We have observe that the sample with 5 and 15 minutes plasma treat at 1 hour and sample 10 minutes plasma treat at 30 minutes, exhibits better memristive compared before anneal process.
Metadata
| Item Type: | Article |
|---|---|
| Creators: | Creators Email / ID Num. Mohd Salleh, Mohd Fadzlie 2009133761 |
| Subjects: | T Technology > TA Engineering. Civil engineering > Materials of engineering and construction > Physical properties > Surface effects and tests T Technology > TK Electrical engineering. Electronics. Nuclear engineering > Electronics > Apparatus and materials > Semiconductors |
| Divisions: | Universiti Teknologi MARA, Shah Alam > Faculty of Electrical Engineering |
| Page Range: | pp. 1-7 |
| Keywords: | Component, Memristor, TiO₂, Plasma treatment, Titania, Sputtering |
| Date: | 2013 |
| URI: | https://ir.uitm.edu.my/id/eprint/125700 |
