Ohmic contacts properties Pd/Ag metallization scheme on P-type GaN / C. W. Lim … [et al.]

Lim, C. W. and Yam, F.K. and Tan, C.K. and A., Abdul Aziz and Z., Hassan (2004) Ohmic contacts properties Pd/Ag metallization scheme on P-type GaN / C. W. Lim … [et al.]. In: STSS 2004 : Sains Teknologi Jilid 1, 31 Mei – 1 Jun 2004, Hotel Vistana, Kuantan, Pahang.

Abstract

In this work, we report on the characteristics of Pd/Ag metallization scheme deposited using thermal evaporation for the formation of ohmic contacts to p-type GaN. The electrical behavior and thermal stability at different annea1ing temperatures (400DC - 800DC) were: investigated. Specific contact resistivity using transmission Line Method (TLM) and current voltage (J-V) measurements were investigated. The minimum specific contact resistivity of 3.9 Qcm2 achieved after annealing at SOODC for 6 minutes. Changes in tile surface morphology off the contacts were observed using Scanning Electron Microscopy (SEM).

Metadata

Item Type: Conference or Workshop Item (Paper)
Creators:
Creators
Email / ID Num.
Lim, C. W.
UNSPECIFIED
Yam, F.K.
UNSPECIFIED
Tan, C.K.
UNSPECIFIED
A., Abdul Aziz
UNSPECIFIED
Z., Hassan
UNSPECIFIED
Subjects: Q Science > QC Physics > Heat > Temperature
Q Science > QC Physics > Electron
T Technology > TK Electrical engineering. Electronics. Nuclear engineering > Electronics
Divisions: Universiti Teknologi MARA, Pahang > Jengka Campus
Journal or Publication Title: Sains Teknologi Jilid 1
Event Title: STSS 2004 : Sains Teknologi Jilid 1
Event Dates: 31 Mei – 1 Jun 2004
Page Range: pp. 245-249
Keywords: Ohmic contact, specific contact resistivity, surface morphology, transmission line method
Date: 2004
URI: https://ir.uitm.edu.my/id/eprint/51193
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