Abstract
Six Sigma methodology is the quality technique that eliminates or reduce the defects by focusing on the output of the process and improve the existing process. The objectives of this study were to implement the Six Sigma methodology in the packaging manufacturing process and also to find and eliminate the root causes of the problem that effect the critical to quality (CtQ) of the product. The study had been conducted in Company X for two weeks, which the data had been collected for 2 to 3 times per day. The parameter considered in this study was the speed of the sheet per minutes of packaging produced. The data was collected to find the problem of the measurement of the glue gap. The collected data was analysed by using capability analysis in Minitab statistical software. The result obtained from the analysis indicate that the process was improved from the old process. The Sigma level had shown the improvement from level between 1 and 2 to level between 3 and 4. Although it is impossible to achieve the perfect process and reduce the defects to the level of 3.4 ppm, the improvement in the process show that Six Sigma methodology can increase the quality and decrease the defects of the product.
Metadata
| Item Type: | Article |
|---|---|
| Creators: | Creators Email / ID Num. Anuar, Mohd Fathul Haqim UNSPECIFIED Abd Karim, Siti Fatma UNSPECIFIED |
| Subjects: | T Technology > TS Manufactures T Technology > TS Manufactures > Production management. Operations management T Technology > TS Manufactures > Production management. Operations management > Control of production systems T Technology > TS Manufactures > Production management. Operations management > Control of production systems > Quality control. Standards |
| Divisions: | Universiti Teknologi MARA, Shah Alam > Faculty of Chemical Engineering |
| Page Range: | pp. 1-6 |
| Keywords: | Six Sigma, DMAIC, Minitab statistical software, Glue gap measurement, Capability analysis |
| Date: | 2017 |
| URI: | https://ir.uitm.edu.my/id/eprint/123340 |
