Items where Author is "Mayappan, Ramani"

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Number of items: 3.

Article

The evolution of interfacial intermetallic compound growth and solder joint strength of Sn-40Pb/Cu under thermal aging / Ramani Mayappan. (2024) Scientific Research Journal, 21 (2): 4. pp. 57-72. ISSN 1675-7009

The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan. (2012) Jurnal Intelek, 7 (2). pp. 9-15. ISSN 2682-9223

Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad. (2010) Scientific Research Journal, 7 (2). pp. 1-17. ISSN 1675-7009

This list was generated on Sat Nov 23 22:11:45 2024 UTC.