Items where Author is "Mayappan, Ramani"
![[up]](/style/images/multi_up.png)
Up a levelGroup by: Item Type | No Grouping
Number of items: 3.
The evolution of interfacial intermetallic compound growth and solder joint strength of Sn-40Pb/Cu under thermal aging / Ramani Mayappan. (2024) Scientific Research Journal, 21 (2): 4. pp. 57-72. ISSN 1675-7009
The Sn-3.5Ag-1.0Cu-0.1Zn/Cu intermetallic interface under thermal aging / Iziana Yahya, Hamidi Abd Hamid and Ramani Mayappan. (2012) Jurnal Intelek, 7 (2). pp. 9-15. ISSN 2682-9223
Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad. (2010) Scientific Research Journal, 7 (2). pp. 1-17. ISSN 1675-7009