Items where Author is "Lee, Kong Chian"

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Article

(2018) Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]. Journal of Mechanical Engineering (JMechE), SI 5 (2). pp. 169-180. ISSN 18235514

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