Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]

Singh, Amares and Durairaj, Rajkumar and Lee, Kong Chian and Sia, Yaw Yoong (2018) Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]. Journal of Mechanical Engineering (JMechE), SI 5 (2). pp. 169-180. ISSN 18235514

Abstract

Solder alloys are vital in any electronic packaging industry especially in terms of its connectivity with the substrate. Mechanical properties are usually associated to prove and test the reliability of the solder and substrate. Ultimately, the customary Sn-Pb solders are known to be the ideal solders which solves the issue as mentioned. Sadly, this plumbum (Pb) contained solder alloy is harmful to the environment and human, leading to application of lead free solder alloys. Keeping that in perspective, this research investigates the mechanical properties of the lead free Sn-3.8Ag-0.7Cu (SAC) lead free solder alloy comprising the study in melting temperature, microstructure, wettability, shear strength and hardness. Melting temperature of the SAC solder alloy falls below the required soldering temperature of 250°C. Investigation shows that this solder alloy joint with the copper (Cu) substrate provides a low contact angle of 24.8°. Microstructure study of SAC meanwhile shows a well-defined structure with dendrite shaped Sn-matrix with wider eutectic range, which contributes to the mechanical strengthening effect. The shear strength of this solder alloy was also noted to be as high as 44.84MPa together with high hardness value of 14.4Hv. All these results clearly satisfies the environment concern and importantly confirming the reliability of the solder and substrate.

Metadata

Item Type: Article
Creators:
CreatorsEmail / ID. Num
Singh, AmaresUNSPECIFIED
Durairaj, RajkumarUNSPECIFIED
Lee, Kong ChianUNSPECIFIED
Sia, Yaw YoongUNSPECIFIED
Subjects: T Technology > TA Engineering. Civil engineering > Engineering machinery, tools, and implements
T Technology > TJ Mechanical engineering and machinery
Divisions: Universiti Teknologi MARA, Shah Alam > Faculty of Mechanical Engineering
Journal or Publication Title: Journal of Mechanical Engineering (JMechE)
Journal: UiTM Journal > Journal of Mechanical Engineering (JMechE)
ISSN: 18235514
Volume: SI 5
Number: 2
Page Range: pp. 169-180
Item ID: 39387
Uncontrolled Keywords: Sn-Ag-Cu Lead Free Solder Alloy, Wettability, Shear Strength, Hardness, Intermetallic Compound (IMC)
URI: http://ir.uitm.edu.my/id/eprint/39387

Download

[img] Text
39387.pdf

Download (433kB)

Others


View in Google Scholar

Actions (login required)

View Item View Item

Downloads

Downloads per month over past year