Items where Author is "Hoi, Ern Kok"

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Article

DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. (2021) Journal of Mechanical Engineering, 18 (3): 8. pp. 131-145. ISSN 2550 - 164X

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