Items where Author is "Hoi, Ern Kok"

[up] Up a level
Group by: Item Type | No Grouping
Number of items: 1.

DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli. (2021) Journal of Mechanical Engineering, 18 (3): 8. pp. 131-145. ISSN 2550 - 164X

This list was generated on Wed Nov 27 05:04:16 2024 UTC.