Heat transfer in switch / Muhamad Asraf Mohd

Mohd, Muhamad Asraf (2017) Heat transfer in switch / Muhamad Asraf Mohd. Degree thesis, Universiti Teknologi MARA (UiTM).

Abstract

Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the base material and aluminum is used to be the connector of the switch when being supplied by 1.6 a by using same value of parameter of the switch and different value of parameter of the switch.

Metadata

Item Type:	Thesis (Degree)
Creators:	Creators Email / ID Num. Mohd, Muhamad Asraf 2013887118
Contributors:	Contribution Name Email / ID Num. Thesis advisor Alip, Rosalena Irma UNSPECIFIED
Subjects:	T Technology > TK Electrical engineering. Electronics. Nuclear engineering
Divisions:	Universiti Teknologi MARA, Shah Alam > Faculty of Electrical Engineering
Programme:	Bachelor of Electrical Engineering
Keywords:	Beryllium copper, sketching parameter
Date:	2017
URI:	https://ir.uitm.edu.my/id/eprint/98483