Sahib @ Sahibuddin, Shahrin
(2023)
Speech text of signing ceremony memorandum of understanding between Universiti Teknologi MARA and Dexcom (M) Sdn Bhd / Prof. Datuk Dr. Shahrin Sahib @ Sahibuddin.
In: Signing Ceremony Memorandum of Understanding between Universiti Teknologi MARA and Dexcom (M) Sdn Bhd, 30 November 2023.
Abstract
Alhamdulillah, praise be to Allah S.W.T. for His abundant blessings and the opportunity to gather here today for another significant endeavour for UiTM, especially for the College of Engineering. 2. A warm welcome I bid to all in attendance for the Memorandum of Understanding (MoU) signing ceremony between Universiti Teknologi MARA (UiTM) and Dexcom (M) Sdn Bhd. 3. It is indeed a pleasure to be here this morning as this MoU marks a valuable collaborative venture in the student development programme, promoting student talent globally and community work.
Metadata
| Item Type: | Conference or Workshop Item (Speech) |
|---|---|
| Creators: | Creators Email / ID Num. Sahib @ Sahibuddin, Shahrin UNSPECIFIED |
| Subjects: | L Education > LG Individual institutions > Asia > Malaysia > Universiti Teknologi MARA |
| Divisions: | Universiti Teknologi MARA, Shah Alam > Vice Chancellor Office |
| Event Title: | Signing Ceremony Memorandum of Understanding between Universiti Teknologi MARA and Dexcom (M) Sdn Bhd |
| Event Dates: | 30 November 2023 |
| Page Range: | pp. 1-7 |
| Keywords: | MoU, UiTM, Dexcom (M) Sdn Bhd |
| Collections: | UiTM Vice Chancellor |
| Date: | 2023 |
| URI: | https://ir.uitm.edu.my/id/eprint/92986 |
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