Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah

Mohamed, Mazlan and Atan, Rahim and Abdullah, Mohd Zulkifly (2011) Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah. ESTEEM Academic Journal, 7 (1). ISSN 1675-7939

Abstract

This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.

Item Details

Item Type:	Article
Creators:	Creators Email / ID Num. Mohamed, Mazlan UNSPECIFIED Atan, Rahim UNSPECIFIED Abdullah, Mohd Zulkifly UNSPECIFIED
Subjects:	Q Science > QC Physics > Heat
Divisions:	Universiti Teknologi MARA, Shah Alam > Faculty of Mechanical Engineering
Journal or Publication Title:	ESTEEM Academic Journal
UiTM Journal Collections:	UiTM Journals > ESTEEM Academic Journal (EAJ)
ISSN:	1675-7939
Volume:	7
Number:	1
Date:	2011
URI:	https://ir.uitm.edu.my/id/eprint/8790

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