Mohamed, Mazlan and Atan, Rahim and Abdullah, Mohd Zulkifly
(2011)
Three dimensional analysis using finite volume based CFD simulation to determine junction temperature on electronic components / Mazlan Mohamed, Rahim Atan and Mohd Zulkifly Abdullah.
ESTEEM Academic Journal, 7 (1).
ISSN 1675-7939
Abstract
This paper presents the simulation of three dimensional numerical analysis of heat and fluid flow through chip package.
Metadata
| Item Type: | Article |
|---|---|
| Creators: | Creators Email / ID Num. Mohamed, Mazlan UNSPECIFIED Atan, Rahim UNSPECIFIED Abdullah, Mohd Zulkifly UNSPECIFIED |
| Subjects: | Q Science > QC Physics > Heat |
| Divisions: | Universiti Teknologi MARA, Shah Alam > Faculty of Mechanical Engineering |
| Journal or Publication Title: | ESTEEM Academic Journal |
| UiTM Journal Collections: | UiTM Journal > ESTEEM Academic Journal (EAJ) |
| ISSN: | 1675-7939 |
| Volume: | 7 |
| Number: | 1 |
| Date: | 2011 |
| URI: | https://ir.uitm.edu.my/id/eprint/8790 |
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