The effect of non-metallic dopants addition on the properties of lead-free solders – a review / Nurathiqah Baharuddin

Baharuddin, Nurathiqah (2022) The effect of non-metallic dopants addition on the properties of lead-free solders – a review / Nurathiqah Baharuddin. [Student Project] (Submitted)

Abstract

The objective of this review is to study the effect of non-metallic dopants addition on the properties of lead-free solder. These properties are important as it portray a good solder that can be used in electronic devices. Variety of lead-free solder and non-metallic dopants are being analyzed by using previous study by other researchers. This review is focusing on the influence of variety non-metallic dopants in the melting temperature, intermetallic, solder joint strength and electrical properties, as full understanding of the process that determine a good and reliable solder, which can replace the hazardous lead solder. At the end of this review, the effects of non-metallic dopants addition are explained which have affect the properties of lead-free solder.

Metadata

Item Type:	Student Project
Creators:	Creators Email / ID Num. Baharuddin, Nurathiqah UNSPECIFIED
Contributors:	Contribution Name Email / ID Num. Advisor Mayappan, Ramani UNSPECIFIED
Subjects:	Q Science > QD Chemistry > Physical and theoretical chemistry
Divisions:	Universiti Teknologi MARA, Perlis > Arau Campus > Faculty of Applied Sciences
Programme:	Bachelor of Sciences (Hons.) Physic
Keywords:	non-metallic dopants, lead-free solder
Date:	2022
URI:	https://ir.uitm.edu.my/id/eprint/83262