Effective removal of copper ion from aqueous solution using beads of chitosan-choline chloride or glycerol deep eutectic solvent / Nur Hidayah Sazali … [et al.]

Sazali, Nur Hidayah and Kong, Sein Ann and Mohd Suah, Faiz Bukhari and Miskam, Mazidatulakmam and Rahim, Nurul Yani (2022) Effective removal of copper ion from aqueous solution using beads of chitosan-choline chloride or glycerol deep eutectic solvent / Nur Hidayah Sazali … [et al.]. Scientific Research Journal, 19 (2): 2. pp. 23-37. ISSN 2289-649X

Abstract

Herein, adsorption process based on new adsorbent was utilized to remove copper ion (Cu(II)), an environmental pollutant, from water. The reprocessing of powder chitosan into a highly porous bead would have the advantage for the industrial treatment of water. Chitosan–deep eutectic solvent (DES) beads were prepared from chitosan and DESs. The DESs used were choline chloride–urea (DES A) and choline chloride–glycerol (DES B). Both chitosan–DES beads were used to remove Cu(II) from an aqueous solution. Based on the characterisation results, chitosan-DES A showed a higher chemical and thermal stability when compared to chitosan-DES B. For type of adsorbents, chitosan-DES B showed a higher removal percentage of Cu(II) (90.92 %) than chitosan-DES A (7.5 %). Therefore, chitosan-DES B was chosen as the preferred adsorbent for Cu(II). The optimum conditions for the removal of Cu(II) from aqueous solution were using 0.09 g of chitosan-DES B with 40 min of shaking time and 1 mg L-1 of initial concentration.

Metadata

Item Type: Article
Creators:
Creators
Email / ID Num.
Sazali, Nur Hidayah
UNSPECIFIED
Kong, Sein Ann
UNSPECIFIED
Mohd Suah, Faiz Bukhari
UNSPECIFIED
Miskam, Mazidatulakmam
UNSPECIFIED
Rahim, Nurul Yani
UNSPECIFIED
Divisions: Universiti Teknologi MARA, Shah Alam > Others
Journal or Publication Title: Scientific Research Journal
UiTM Journal Collections: UiTM Journal > Scientific Research Journal (SRJ)
ISSN: 2289-649X
Volume: 19
Number: 2
Page Range: pp. 23-37
Date: September 2022
URI: https://ir.uitm.edu.my/id/eprint/66402
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