Intermetallic growth kinetics of SN-3.5AG solder sandwiched between two copper substrates / Nurfarahin Mohamad Nazri

Solder is an alloy with low melting temperatures which is commonly used to joint electronic parts together. Most commonly used solder are usually consist of tin and lead, however the use of lead is prohibited since it brings harm towards the environment. Therefore in this research, the study of Sn-3.5Ag solder in replacement to lead based solder has been conducted. The formation and intermetallic compound (IMC) growth of Sn-3.5Ag solder at interface between Cu substrate has been observed for five samples during liquid state aging at250°C for 1, 10, 20, 30 and 40 minutes respectively. It is found that the morphological of IMCs as well as the thickness of the IMC layer changed as aging time increases. The interfacial morphology of the solder initially remained as a columnar type later transformed into the scallop type due to the competition between the IMCs growth and the dissolution of Cu from the substrate.