Properties of hybrid particleboard from kelempayan and rice husk using urea formaldehyde / Najiha Mohd Nasir

Mohd Nasir, Najiha (2020) Properties of hybrid particleboard from kelempayan and rice husk using urea formaldehyde / Najiha Mohd Nasir. [Student Project] (Unpublished)

Abstract

This study focus on alternative species to produce particleboard with target density
of 700 kgm-2. Kelempayan wood ( Neolamarkia cadamba ) was mixed with rice
husk to investigate properties of particleboard. The objectives of this study to
determine the mechanical and physical properties of hybrid particleboard made
from a mixture of Neolamarckia cadamba and rice husk. The study was also to
evaluate the effect of particle ratio and resin content on particleboard properties.
The particle ratio between species is Kelempayan : Rice husk 50:50, 70:30 and
90:10. The percentage of resin content is 8%, 10% and 12%. The Modulus of
Rupture (MOR) and Modulus of Elasticity (MOE), Internal bonding and Thickness
swelling of particleboard was determined according to British Standard Institution
(BS EN Standard). Based on the study conducted, Kelempayan and Rice husk are
considered suitable to be used as substitute raw materials for particleboard
manufacture. However, it is recommended that more study with broader scope
should be conducted on particleboard are necessary for both researchers and
manufacturers to planning and constructing the better performance particleboard
mills in Malaysia.

Metadata

Item Type: Student Project
Creators:
Creators
Email / ID Num.
Mohd Nasir, Najiha
UNSPECIFIED
Subjects: S Agriculture > SB Plant culture > Field crops
T Technology > TP Chemical technology > Gums and resins
T Technology > TS Manufactures > Engineered wood. Fiberboard, particle board, etc.
Divisions: Universiti Teknologi MARA, Pahang > Jengka Campus > Faculty of Applied Sciences
Programme: Bachelor of Science (HONS.) Furniture Technology
Keywords: Kelempayan wood, Neolamarkia cadamba, Particleboard, Rice husk
Date: January 2020
URI: https://ir.uitm.edu.my/id/eprint/41553
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