Developing the optical dicing machine with parametric study of micro-patterning waveguide

Dicing is the precise process of cutting semiconductor wafers into small pieces with high accuracy. The micro-patterning waveguide (MPW), a multilayer optical thin film fabricated using sol-gel procedures for photonic integrated circuits, presents significant challenges in dicing due to its inherent brittleness. To address this, a local dicing machine was introduced to facilitate the dicing of MPWs while maintaining the necessary high-quality surface finish. This study focuses on three objectives: (1) designing, assembling, and calibrating an in-house optical dicing machine, (2) analysing the progression of blade wear and its impact on substrate quality, and (3) determining the effects of cutting parameters (spindle speed, feed rate, and coolant) on the micro-patterning waveguide through experimental study and ANOVA analysis. The primary phase of this study is to design and develop an optical dicing machine capable of cutting MPWs into small pieces with high accuracy and efficiency. Following a detailed design and development phase, the machine was calibrated according to ISO 230-2 standards. This study describes the development process of the optical dicing machine, and the experimental work carried out. The machine incorporates a novel design featuring a 5-axis CNC controller, enabling precise control over critical cutting parameters, including spindle speed, feed rate, and coolant application. The impact of cutting blade wear on the substrate was investigated, highlighting its contribution to surface quality degradation. Additionally, a comprehensive experimental study, analysed using ANOVA, investigated the impact of cutting parameters on MPW surface roughness. Results revealed spindle speed as the most significant factor (32% PCR), followed by coolant usage (29% PCR) and feed rate (23% PCR). The optimal combination for minimising surface roughness was identified as a spindle speed of 3000 rpm, a feed rate of 20 mm/s, and the use of coolant. This study demonstrates a successful approach to achieving high-quality dicing of MPWs, paving the way for improved fabrication of photonic devices.