Floating mechanism of the passive electronic component of the die-side capacitor

Reflow soldering is a widely used process in mass production, particularly in electronic assembly lines. However, defects such as solder bridging, fillet lifting, and tombstoning often arise due to capillary forces that act on molten solder during the transient liquefaction phase. This study investigates the floating mechanism of passive electronic components, specifically the Die-Side Capacitor, by analyzing the wettability of molten solder under dynamic capillary wetting behaviour. The research employs analytical force equations to evaluate solder joint formation. Results indicate that controlling solder volume and optimizing surface tension properties can enhance capillary pressure, increase gap height and reduce defects such as solder bridging, ultimately improving soldering reliability in electronic components.