Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid

The aim for this analysis is to perform simulation and steady-state analysis in structural discipline on wire bonding for various forces and pressure loading on both copper (Cu) and gold (Au) materials. This analysis will consider the size, temperature and properties of each material which resulting the stress on structural. The features of the copper material such as much lower cost, high conductivity, high melting point and strong resistance make it an ideal choice for many new applications. The scope of this study includes the modeling of wire bonding, defining the geometries and properties of each material using finite element method. Simulation is conducted using software ANSYS Multiphysics in order to analyze the structural characteristics and the stress distribution of copper and gold wire bonding under thermocompression wire bonding process. This research focused on two parts; the free air ball and heat affected zone of the wire bonding structure. Results show that von Mises stress of gold wire bonding simulation is 1.25% than copper at pressure 300MPa while 9.1% difference at pressure 500MPa. For first principal, copper and gold show 6.45% difference at 300MPa and 9.35% difference at 500MPa.