UiTM signs Memorandum of Understanding (MoU) with THB Maintenance Sdn. Bhd. / Nor Azlan Othman and Nor Aziyah Bakhari

Othman, Nor Azlan and Bakhari, Nor Aziyah (2021) UiTM signs Memorandum of Understanding (MoU) with THB Maintenance Sdn. Bhd. / Nor Azlan Othman and Nor Aziyah Bakhari. UiTM MOU / MoA.

Abstract

A Memorandum of Understanding (MoU) has been signed between Universiti Teknologi MARA (UiTM) and THB Maintenance Sdn. Bhd. at the THB Maintenance Sdn. Bhd. Headquarters, Alor Star, Kedah. The signing of this MoU will create new opportunities for both parties. This collaboration is the perfect platform for borderless and global education where all parties will have the opportunity to generate new knowledge and ideas through various activities and projects involving students and staff of UiTM with the industry. This Moll will build a bridge between the academicians and industry players benefiting the staff and students as well as UiTM- THB Maintenance staff in the areas of research development, innovation, curriculum, CSR, human capital, technology and others.

Metadata

Item Type: Article
Creators:
Creators
Email / ID Num.
Othman, Nor Azlan
UNSPECIFIED
Bakhari, Nor Aziyah
UNSPECIFIED
Contributors:
Contribution
Name
Email / ID Num.
UiTM Representative
Kasolang, Salmiah
UNSPECIFIED
UiTM Representative
Bakhari, Nor Aziyah
UNSPECIFIED
Agency Representative
Ahmad Tarmizi, Mohd Firdaus
UNSPECIFIED
Agency Representative
Hasnur Rabiaian, Azmir
UNSPECIFIED
Subjects: L Education > L Education (General)
L Education > LC Special aspects of education
L Education > LC Special aspects of education > Education and globalization. Education and society
L Education > LC Special aspects of education > Education and globalization. Education and society > Malaysia
Divisions: Universiti Teknologi MARA, Pulau Pinang > Permatang Pauh Campus
Journal or Publication Title: UiTM MOU / MoA
Keywords: Universiti Teknologi MARA (UiTM), THB Maintenance Sdn. Bhd, MoU
Collections: UiTM MoU / MoA
Date: 20 April 2021
URI: https://ir.uitm.edu.my/id/eprint/64072
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64072

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