Electrodeposition and characterization of copper coating on stainless steel substrate from alkaline copper solution containing Ethylenediaminetetraacetate (EDTA) / Nik Norziehana Che Isa...[et al.]

Che Isa, Nik Norziehana and Mohd, Yusairie and Mohd Zaki, Mohammad Hafizudden and Syed Mohamad, Sharifah Aminah (2017) Electrodeposition and characterization of copper coating on stainless steel substrate from alkaline copper solution containing Ethylenediaminetetraacetate (EDTA) / Nik Norziehana Che Isa...[et al.]. Journal of Mechanical Engineering (JMechE), SI 2 (1). pp. 127-138. ISSN 1823-5514 ; 2550-164X

Abstract

Copper coating was successfully deposited onto 304 stainless steel substrate from pH 8 EDTA solution containing 0.01 M Cu2+ ions, added as CuSO4. The nature of 304 stainless steel electrode reactions in solutions was determined by cyclic voltammetry. Based on cyclic voltammetric analysis, –1.1 V is related to the Cu2+ ions reduction and the suitable applied potential for further electrodeposition process. Chronoamperometric study was done by applying a constant potential at –1.1 V at different deposition times. Morphological observation revealed that deposition time has strongly affected the surface coverage of the copper coating on the 304 stainless steel surface. Crystalline pure copper phase was determined by XRD. The coating has excellent adhesion which passed the tape test. This study showed that the copper coatings with good surface coverage and adhesion can be prepared on the 304 stainless steel substrate.

Metadata

Item Type: Article
Creators:
CreatorsEmail / ID. Num
Che Isa, Nik NorziehanaUNSPECIFIED
Mohd, YusairieUNSPECIFIED
Mohd Zaki, Mohammad HafizuddenUNSPECIFIED
Syed Mohamad, Sharifah AminahUNSPECIFIED
Subjects: T Technology > TJ Mechanical engineering and machinery
Divisions: Universiti Teknologi MARA, Shah Alam > Faculty of Mechanical Engineering
Journal or Publication Title: Journal of Mechanical Engineering (JMechE)
Journal: UiTM Journal > Journal of Mechanical Engineering (JMechE)
ISSN: 1823-5514 ; 2550-164X
Volume: SI 2
Number: 1
Page Range: pp. 127-138
Official URL: https://jmeche.uitm.edu.my/
Item ID: 37557
Uncontrolled Keywords: Copper; Copper Coating; Copper Reduction; Electrodeposition; Ethylenediaminetetraacetate
URI: http://ir.uitm.edu.my/id/eprint/37557

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