UiTM staff trained in advanced IC fabrication and assembly at ADTEC Taiping

This advanced industrial training program undertaken by academic staff from Universiti Teknologi MARA (UiTM), involving faculty members from the Faculty of Electrical Engineering (FKE) across Shah Alam, Penang, and Pasir Gudang campuses, alongside the Faculty of Applied Sciences (FSG) Shah Alam. Conducted from September 2 to 6, 2025, at ADTEC Taiping, the intensive training focused on two specialized domains: Advanced IC Fabrication (Front-End) and Advanced IC Assembly (Back-End). Led by experienced ADTEC technical instructors, the front-end module engaged 12 lecturers in core wafer fabrication processes—including oxidation, photolithography, etching, diffusion, ion implantation, thin-film deposition, and process integration. Concurrently, the back-end assembly module provided 15 lecturers with practical immersion in package design, die attach, wafer mounting, wire bonding, molding, plating, trim-and-form operations, dambar cutting, crop procedures, and post-assembly product testing. By combining hands-on technical execution with theoretical principles, this capacity-building initiative directly aligns with Malaysia's 2025 Semiconductor Budget priorities, significantly enhancing UiTM's institutional teaching standards, curriculum design, and applied research capabilities to support the national semiconductor ecosystem.