The increasing use of smartphones for high-intensity applications such as mobile gaming has resulted in significant thermal management challenges, affecting device performance and reliability. This project introduces i-MagArctic, an intelligent cooling system that integrates thermoelectric technology with liquid cooling and incorporates an anti-condensation mechanism based on dew point control. The system was evaluated through a 20-minute experimental test, with temperature data recorded at two-minute intervals. The analysis focused on key parameters including peak temperature, average temperature, heating rate, thermal stability, and cooling efficiency. The results indicate that i-MagArctic successfully reduced the smartphone peak temperature from 44°C to 35.9°C and the battery temperature from 41°C to 32.3°C. Additionally, the heating rate was significantly reduced, and temperature stability improved based on lower standard deviation values. The system achieved a cooling efficiency of 18.41% for the smartphone and 21.2% for the battery. Overall, i-MagArctic demonstrates strong effectiveness in managing smartphone thermal performance and shows high potential for commercialization as a mobile gaming accessory.
| Item Type: | Article |
|---|---|
| Creators: | Creators Email / ID Num. Nongkang, Samsur samsur@pss.edu.my Soidon, Azijul UNSPECIFIED Rostam, Muhammad Daniel Haiqal UNSPECIFIED Jasnie, Jasnie UNSPECIFIED |
| Subjects: | T Technology > TJ Mechanical engineering and machinery > Control engineering systems. Automatic machinery (General) T Technology > TK Electrical engineering. Electronics. Nuclear engineering > Cell phones |
| Divisions: | Universiti Teknologi MARA, Selangor > Dengkil Campus > Centre of Foundation Studies |
| Journal or Publication Title: | PITRAM 2026 Pertandingan Inovasi Antara Asasi Malaysia Extended Abstract Book |
| Event Title: | PITRAM 2026 Pertandingan Inovasi Antara Asasi Malaysia |
| Event Dates: | 11-12 April 2026 |
| Page Range: | pp. 197-202 |
| Keywords: | i-MagArctic, Thermoelectric cooling, Smartphone, Anti-condensation, Thermal management |
| Date: | April 2026 |
| URI: | https://ir.uitm.edu.my/id/eprint/145863 |
145863.pdf
