Optimization the copper electroless plating / Ahmad Izzat Emir Atan

Copper electroless plating have been used widely in decoration and corrosion prevention for desired metal. The effect of using difference parameter and condition in copper solution lead to difference result of copper electroless plating. The purpose of this study was to optimize the parameter of copper solution which are pH of solution, plating time, temperature, concentration and the effect in the present of additives which are ethyleneditetraacetic acid and monosodium glutamate. From the results obtained, the optimum pH of copper solution suitable for immersion plating was between pH 3 to 4 and the time used was between 80 second to 90 second. Next, the suitable temperature for immersion plating was between 25 oC to 30 oC to get better adhesion on the metal surface and also the optimum concentration of copper solution was 100 gL-1. The suitable additives for immersion copper electroless plating in this study was monosodium glutamate (MSG). In conclusion, based on the optimization parameter obtained, the immersion copper electroless plating were at pH 4 for 80 s at temperature of 25 oC in 100gL-1 concentration.